grant support

COMPLEX TECHNOLOGY GRANTS SERVICES – OPPORTUNITY HIGHLIGHT: Semiconductor Packaging Research

Overview: On July 9, 2024, the Department of Commerce announced a new funding opportunity to support research and development (R&D) in semiconductor advanced packaging. This initiative, part of the CHIPS (Creating Helpful Incentives to Produce Semiconductors) for America program, aims to boost domestic capabilities in this field with up to $1.6B in funding.

CONTINUE READING