NIST NAPMP Grants

The National Institute of Standards and Technology (NIST) administers the National Advanced Packaging Manufacturing Program (NAPMP) to strengthen the U.S. semiconductor ecosystem through advanced packaging innovations. This program is a key component of the CHIPS and Science Act, aimed at fostering domestic manufacturing capabilities, bolstering supply chain resilience, and advancing the nation’s leadership in semiconductor technologies.

NAPMP grants are designed to support research, development, and deployment of cutting-edge semiconductor packaging technologies, emphasizing collaborative efforts between industry, academia, and government. The program prioritizes projects that address critical challenges in advanced packaging, such as heterogeneous integration, high-density interconnects, and sustainable manufacturing practices.

Applicants are encouraged to demonstrate how their projects will promote workforce development, technological innovation, and economic growth while aligning with national security and economic priorities. Funding is available to eligible entities, including businesses, nonprofit organizations, universities, and consortiums, with a focus on fostering partnerships to maximize impact.

By supporting innovation in advanced packaging, NAPMP grants aim to ensure that the U.S. remains at the forefront of semiconductor manufacturing while securing the supply chain for future generations. For those looking to contribute to this critical national effort, these grants offer an exceptional opportunity to gain funding and support for groundbreaking initiatives.